3W UV LASER MARKING for PLASTIC MARKING/ CERAMIC/ FIBER GLASS

Ultraviolet  355nm Fiber Laser System deliver some of the highest absorption rates, minimizing heat stress that can lead to damaged products.

$8,200.00

Product ID: 6909 Category: Tag:

FIBER LASER MACHINE OVERVIEW:

UV Laser Marking Machine uses a 355 nm laser wavelength. These ultraviolet wavelengths deliver some of the highest absorption rates, minimizing heat stress that can lead to damaged products.

UV Lasers operate at 355nm by doubling the frequency this laser source has a much smaller spot size than any other laser marking system on the market. When operating at 355nm or UV you are able to mark on plastics, ceramics, fiber glass and have the surface uneffected. It is the ideal choice for marking on organic material. Dont let the low wattage mis-lead you. Since these laser operate at a lower pulse width the peak is still in the kilawatts. With the very high peak power and short pulse width you will have an extremely small HAZ or Heat Effective Zone.

 

FEATURES:

  • High laser beam quality, tiny light spot, hyperfine marking, and the minimum character can up to 0.2mm.
  • 355nm outgoing wavelength reduces the thermal effect on the workpiece; the heat affected zone will not bring about heat effect, material no deforming or burning.
  • In terms of appearance, the MT-UV series UV laser marking engraving machine adopts closed processing for vertical sliding door design and adopts high-quality organic glass that is specially used for filtering protection as a dedicated observation window for excellent overall protection performance.
  • Automatic lifting, autofocusing and rotating functions are optional.
  • Faster, better efficiency, high-precision.
  • No consumable material needed, and the low use and maintenance cost.
  • Stable performance ensures long-time running.

Applicable Industry:

Jewellery accessories, eyeglasses, clocks and watches, hardware, tools, accessories, sanitary ware, ceramic plastic, PVC, phone keypad, electronic components, integrated circuits IC, precision equipment, medical equipment, etc.

 

Product Specifications:

Laser source :
Ytterbium Fiber Laser

Laser power :
10/20/30W

Wavelength :
1060-1070nm

Operation  type:Q – switched

Laser frequency :
20-80KHz

Minimum line width :
0.00078″ (0.02mm)

Minimum character size :
0.0078″ (0.2mm)

Repeatability :
0.00004″ (0.001mm)

Marking area :
12″x12″ (300x300mm)

Cooling system :
Air cooling

Marking table :
X , Y and Z axis table

Marking Depth :
Up to 0.039″ (1mm)

Max.power consumption:
550W

Power supply :
110/ 220V 50-60Hz

Machine dimensions(L×W×H) :
31″x25.5″x57″ (800×650×1450mm)   Full size machine

25.5″x20″x9″(650x500x220mm)  Portable type machine

Net Weight :
150lbs (68Kg),  77lbs(35kg)

Free Tech Support

Two Year Limited Warranty

SPECIFICATIONS:

Laser power :
5W

Wavelength:
355nm

Marking Area:
110*110mm/175*175mm/220*220mm

Laster Source:
JPT Seal-355-5

Repetition Rate Frequency:
20-200kHZ

Spot Size:
0.00025

Output power adjustment range:
10%-100%

Marking Speed:
8m/s

Engraving Depth:
≤0.01-0.5mm (Depends on the material)

Min. Line Width:
≤0.01mm (Depends on the material)

Min. Character:
0.15mm (Depends on the material)

Input Voltage:
110V-240V/50-60Hz

Complete Power Consumption:
≤1500W

Cooling Way:
Air-cooling

Machine Dimension:
370x490x230mm

Package dimensions(L×W×H) :
600×650×700mm

Net Weight :
66lbs (30Kg)

Free Tech Support

Two Year Limited Warranty

Accessories included:

Rotary attachment (workable diameter 1-80mm)


Shipping Method:

• via DHL Express, shipping cost $500, delivery time 7-10 days

Whats in the box:

•3watt DPSS Source
•Galvo Head
•F-Theta Lens
•Laser Rail
•Zaxis Slide
•Marking Station
•Industrial Case
•EZCAD Marking Software

APPLICATIONS:

Medical device manufacturers use UV or “cold marking” solutions to create smooth, hygienic marks required by the FDA, including Unique Device Identification marks. In electronics and automotive industries, UV lasers allow companies to mark small, delicate components, including circuit boards and silicon wafers, with less waste.

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